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  1. Casa
  2. Productos
  3. Componentes pasivos
  4. Componentes SAMSUNG
  5. Subsystem

Subsystem Componentes SAMSUNG

Integrated Circuits (ICs)RF/IF and RFIDPassive ComponentsElectronic Components
  • Linear - Amplifiers - Audio
  • Data Acquisition - ADCs/DACs - Special Purpose
  • RF Misc ICs and Modules
  • RF Front End (LNA + PA)
  • SAMSUNG Components
  • Texas TI IC
  • Intersil IC
  • Cypress IC
Número de pieza Fabricante / Marca Breve descripción
KB8527
SAMSUNG 1 CHIP CLP SUBSYSTEM IC
KB8527B
SAMSUNG 1 CHIP CLP SUBSYSTEM IC
KB8527BQ
SAMSUNG 1 CHIP CLP SUBSYSTEM IC
S1T8527C
SAMSUNG 1 CHIP CLP SUBSYSTEM IC
S1T8527C01-Q0R0
SAMSUNG 1 CHIP CLP SUBSYSTEM IC
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