|
Laird Technologies EMI |
APSTRBFUSFPSA |
Active | Fingerstock | - | 0.670" (17.02mm) | 24.000" (609.60mm) | 0.310" (7.87mm) | Beryllium Copper | - | - | Adhesive | 121°C |
|
Laird Technologies EMI |
APSTRBFUSFPSA |
Active | Fingerstock | - | 0.780" (19.81mm) | 24.000" (609.60mm) | 0.250" (6.35mm) | Beryllium Copper | - | - | Adhesive | 121°C |
|
Laird Technologies EMI |
CLOSTRDLNBFUSFT |
Active | Fingerstock | - | 0.380" (9.65mm) | 16.000" (406.40mm) | 0.200" (5.08mm) | Beryllium Copper | - | - | Clip | 121°C |
|
Laird Technologies EMI |
CLOSTRDLNBFUSF |
Active | Fingerstock | - | 0.380" (9.65mm) | 16.000" (406.40mm) | 0.200" (5.08mm) | Beryllium Copper | - | - | Clip | 121°C |
|
Laird Technologies EMI |
CLOSTRDLNBFUSFT |
Active | Fingerstock | - | 0.330" (8.38mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Beryllium Copper | - | - | Clip | 121°C |
|
Laird Technologies EMI |
GASKET BECU 11.43X411.48MM |
Active | Fingerstock | - | 0.450" (11.43mm) | 16.200" (411.48mm) | 0.122" (3.10mm) | Beryllium Copper | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | 121°C |
|
Parker Chomerics |
CHO-SEAL 1298 AG/AL EMI 0.062 |
Active | Gasket | Round | 0.072" (1.83mm) | - | 0.062" (1.57mm) | Conductive Elastomer | Silver | - | Non-Conductive Adhesive | -29°C ~ 66°C |
|
Laird Technologies EMI |
TWTSTRSNSATPSA |
Active | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.030" (0.76mm) | Beryllium Copper | Tin | 299.21µin (7.60µm) | Adhesive | 121°C |
|
Laird Technologies EMI |
TWTSTRNIDPSA |
Active | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.030" (0.76mm) | Beryllium Copper | Nickel | 299.21µin (7.60µm) | Adhesive | 121°C |
|
Laird Technologies EMI |
TWTSTRZNCPSA |
Active | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.030" (0.76mm) | Beryllium Copper | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | 121°C |
|
Laird Technologies EMI |
TWTSTRSNBPSA |
Active | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.030" (0.76mm) | Beryllium Copper | Tin | 299.21µin (7.60µm) | Adhesive | 121°C |
|
Laird Technologies EMI |
TWTSTRNIBPSA |
Active | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.030" (0.76mm) | Beryllium Copper | Nickel | 299.21µin (7.60µm) | Adhesive | 121°C |
|
Laird Technologies EMI |
TWTSTRSNSATRAPSA |
Active | Fingerstock | - | 0.160" (4.06mm) | 24.000" (609.60mm) | 0.030" (0.76mm) | Beryllium Copper | Tin | 299.21µin (7.60µm) | Adhesive | 121°C |
|
Laird Technologies EMI |
TWTSTRZNCRAPSA |
Active | Fingerstock | - | 0.160" (4.06mm) | 24.000" (609.60mm) | 0.030" (0.76mm) | Beryllium Copper | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | 121°C |
|
Laird Technologies EMI |
TWT17SNIBPSA |
Active | Fingerstock | - | 0.160" (4.06mm) | 24.000" (609.60mm) | 0.030" (0.76mm) | Beryllium Copper | Nickel | 299.21µin (7.60µm) | Adhesive | 121°C |
|
Laird Technologies EMI |
GK NICU NRSG PU V0 DSH |
Active | Fabric Over Foam | D-Shape | 0.252" (6.40mm) | 48.000" (121.92cm) | 0.252" (6.40mm) | - | - | - | Adhesive | - |
|
Laird Technologies EMI |
GK SNCU NRS PU V0 REC |
Active | Fabric Over Foam | Rectangle | 0.118" (3.00mm) | 48.000" (121.92cm) | 0.039" (1.00mm) | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | - | - | - | - |
|
Laird Technologies EMI |
GK SNCU NRS PU V0 REC |
Active | Fabric Over Foam | Rectangle | 0.091" (2.30mm) | 48.000" (121.92cm) | 0.051" (1.30mm) | - | - | - | - | - |
|
Leader Tech Inc. |
.051H X .394W X 11L--RECTANGU |
Active | Fabric Over Foam | Rectangular | 0.394" (10.01mm) | 11.000" (279.40mm) | 0.051" (1.30mm) | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | - | - | - | -40°C ~ 70°C |
|
Laird Technologies EMI |
CSTRSTRNID |
Active | - | - | - | - | - | - | - | - | - | - |
|
Laird Technologies EMI |
CSTRSTRNIE |
Active | - | - | - | - | - | - | - | - | - | - |
|
Laird Technologies EMI |
CSTRSTRNIB |
Active | - | - | - | - | - | - | - | - | - | - |
|
Laird Technologies EMI |
LSSTRSNBCLO |
Active | Fingerstock | - | 0.295" (7.49mm) | 17.000" (433.22mm) | 0.176" (4.47mm) | Beryllium Copper | Tin | 299.21µin (7.60µm) | Clip | 121°C |
|
Laird Technologies EMI |
GASKET BECU 15.24X457.2MM |
Active | Fingerstock | - | 0.600" (15.24mm) | 18.000" (457.20mm) | 0.220" (5.59mm) | Beryllium Copper | - | - | Slot | 121°C |
|
Laird Technologies EMI |
DESSTRSNBCLO |
Active | - | - | 0.062" (1.59mm) | 12.000" (304.80mm) | - | - | - | - | - | - |
|
Laird Technologies EMI |
DESSTRNIECLO |
Active | - | - | 0.062" (1.59mm) | 12.000" (304.80mm) | - | - | - | - | - | - |
|
Laird Technologies EMI |
DESSTRNIBCLO |
Active | - | - | 0.062" (1.59mm) | 12.000" (304.80mm) | - | - | - | - | - | - |
|
Leader Tech Inc. |
.040H X .125W X 24L--RECTANGU |
Active | Fabric Over Foam | Rectangular | 0.125" (3.18mm) | 24.000" (609.60mm) | 0.040" (1.02mm) | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | - | - | - | -40°C ~ 70°C |
|
Parker Chomerics |
CHO-SEAL 1298 AG/AL EMI 0.065 |
Active | Gasket | Round | 0.076" (1.93mm) | - | 0.066" (1.68mm) | Conductive Elastomer | Silver | - | Non-Conductive Adhesive | -29°C ~ 66°C |
|
Laird Technologies EMI |
CSTRSTRBF |
Active | - | - | - | - | - | - | - | - | - | - |
|
Leader Tech Inc. |
0.03 X 0.20 BD 24--3-20T-BD-24-- |
Active | Fingerstock | - | 0.200" (5.08mm) | 24.000" (609.60mm) | 0.030" (0.76mm) | Beryllium Copper | Unplated | - | Adhesive | -55°C ~ 121°C |
|
Leader Tech Inc. |
0.03 X 0.20 BD 24 NTP--3-20T-BD- |
Active | Fingerstock | - | 0.200" (5.08mm) | 24.000" (609.60mm) | 0.030" (0.76mm) | Beryllium Copper | Unplated | - | Adhesive | -55°C ~ 121°C |
|
Parker Chomerics |
CHO-SEAL 1298 AG/AL EMI 0.070 |
Active | Gasket | Round | 0.086" (2.18mm) | - | 0.070" (1.78mm) | Conductive Elastomer | Silver | - | Non-Conductive Adhesive | -29°C ~ 66°C |
|
Parker Chomerics |
SOFT SHIELD 3700 EMI 1013 24 |
Active | Fabric Over Foam | Rectangle | 0.394" (10.00mm) | 24.000" (609.60mm) | 0.075" (1.91mm) | Nickel-Copper Polyester (NI/CU) | Nickel | - | Adhesive | -40°C ~ 125°C |
|
Laird Technologies EMI |
GK NICU NRSG PU V0 BELL |
Active | Fabric Over Foam | Bell | 0.181" (4.60mm) | 12.510" (317.75mm) | 0.071" (1.80mm) | - | - | - | Adhesive | - |
|
Laird Technologies EMI |
IO NICU PTAFG PU V0 REC |
Active | - | - | - | - | - | - | - | - | - | - |
|
Leader Tech Inc. |
0.03 X 0.23 BD 24--3-23T-BD-24-- |
Active | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.030" (0.76mm) | Beryllium Copper | Unplated | - | Adhesive | -55°C ~ 121°C |
|
Leader Tech Inc. |
0.03 X 0.23 BD 24 NTP--3-23T-BD- |
Active | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.030" (0.76mm) | Beryllium Copper | Unplated | - | Adhesive | -55°C ~ 121°C |
|
Leader Tech Inc. |
0.03 X 0.08 BD 24--TWIST RIGHT A |
Active | Fingerstock | - | 0.080" (2.03mm) | 24.000" (609.60mm) | 0.030" (0.76mm) | Beryllium Copper | Unplated | - | Adhesive | -55°C ~ 121°C |
|
Leader Tech Inc. |
.250X.500X.125 COMBO W/ ADH-- |
Active | Gasket | Rectangular | 0.500" (12.70mm) | - | 0.250" (6.35mm) | - | - | - | - | -75°C ~ 260°C |
|
Laird Technologies EMI |
CSTRFRGBF |
Active | - | - | - | - | - | - | - | - | - | - |
|
Laird Technologies EMI |
GASKET BECU 2.29X609.6MM |
Active | - | - | 0.090" (2.29mm) | 24.000" (609.60mm) | - | - | - | - | - | - |
|
Laird Technologies EMI |
NOSGSTRBF |
Active | Fingerstock | - | 0.250" (6.35mm) | 16.000" (406.40mm) | 0.080" (2.03mm) | Beryllium Copper | - | - | Adhesive | 121°C |
|
Laird Technologies EMI |
CSTRSTRSNB |
Active | - | - | - | - | - | - | - | - | - | - |
|
Leader Tech Inc. |
0.11 X 0.32 SN 16--11-32RH-SN-16 |
Active | Fingerstock | - | 0.320" (8.13mm) | 16.000" (406.40mm) | 0.110" (2.79mm) | Beryllium Copper | Tin | Flash | Adhesive | -55°C ~ 121°C |
|
Laird Technologies EMI |
CSTRMRGBF |
Active | - | - | - | - | - | - | - | - | - | - |
|
Laird Technologies EMI |
GSKT FAB/FOAM 2.3MMX120CM DSHAPE |
Active | Fabric Over Foam | D-Shape | 0.091" (2.30mm) | 48.000" (121.90cm) | 0.091" (2.30mm) | - | - | - | - | - |
|
Laird Technologies EMI |
FINGERSTOCK BECU 19.6X406.4MM |
Active | - | - | 0.772" (19.60mm) | 16.000" (406.40mm) | - | - | - | - | - | - |
|
Laird Technologies EMI |
CLOSTRNIB .210X.600X.187X16IN |
Active | - | - | - | - | - | - | - | - | - | - |
|
Laird Technologies EMI |
NOSG COIL SNB PSA |
Active | Fingerstock | - | 0.380" (9.65mm) | 16.000" (406.40mm) | 0.120" (3.05mm) | Beryllium Copper | Tin | 299.21µin (7.60µm) | Adhesive | 121°C |