Part Number Manufacturer / Brand Brife Description Part StatusApplicationsCurrent - SupplyVoltage - SupplyOperating TemperatureMounting TypePackage / CaseSupplier Device Package
NXP USA Inc. IC SYSTEM BASIS CHIP 32LQFP ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 125°CSurface Mount32-LQFP32-LQFP (7x7)
NXP USA Inc. IC SYSTEM BASIS CHIP 32LQFP ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 125°CSurface Mount32-LQFP32-LQFP (7x7)
NXP USA Inc. IC SYSTEM BASIS CHIP 32LQFP ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 125°CSurface Mount32-LQFP32-LQFP (7x7)
NXP USA Inc. IC SYSTEM BASIS CHIP 32LQFP ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 125°CSurface Mount32-LQFP32-LQFP (7x7)
NXP USA Inc. IC SYSTEM BASIS CHIP 32LQFP ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 125°CSurface Mount32-LQFP32-LQFP (7x7)
NXP USA Inc. IC SYSTEM BASIS CHIP 32LQFP ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 125°CSurface Mount32-LQFP32-LQFP (7x7)
NXP USA Inc. SYSTEM BASIS CHIP DCDC 0.8A VCO ActiveSystem Basis Chip
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-40°C ~ 125°C (TA)Surface Mount48-LQFP Exposed Pad48-LQFP (7x7)
NXP USA Inc. IC SBC HIGH SPEED CAN 5V 32SOIC Last Time BuySystem Basis Chip2mA5.5 V ~ 28 V-40°C ~ 125°CSurface Mount32-BSSOP (0.295", 7.50mm Width) Exposed Pad32-SOIC
NXP USA Inc. IC SBC HIGH SPEED CAN 5V 32SOIC Last Time BuySystem Basis Chip2mA5.5 V ~ 28 V-40°C ~ 125°CSurface Mount32-BSSOP (0.295", 7.50mm Width) Exposed Pad32-SOIC
NXP USA Inc. IC SBC HIGH SPD CAN 3.3V 32SOIC Last Time BuySystem Basis Chip2mA5.5 V ~ 28 V-40°C ~ 125°CSurface Mount32-BSSOP (0.295", 7.50mm Width) Exposed Pad32-SOIC
NXP USA Inc. IC SBC HIGH SPEED CAN 5V 32SOIC Last Time BuySystem Basis Chip2mA5.5 V ~ 28 V-40°C ~ 125°CSurface Mount32-BSSOP (0.295", 7.50mm Width) Exposed Pad32-SOIC
NXP USA Inc. IC SYSTEM BASIS CHIP LIN 32-LQFP ActiveSystem Basis Chip4.5mA5.5 V ~ 18 V-40°C ~ 85°CSurface Mount32-LQFP32-LQFP (7x7)