|
Maxim Integrated |
IC TXRX E1 QUAD 5V 256BGA |
Not For New Designs | Transceiver | E1 | 4 | 5V | - | - | - | Surface Mount | 256-BGA | 256-BGA (27x27) |
|
Microsemi Corporation |
32CHANNEL T1/E1 FRAMER DEVICE WI |
Not For New Designs | - | - | - | - | - | - | - | - | - | - |
|
Microsemi Corporation |
32CHANNEL T1/E1 FRAMER DEVICE WI |
Not For New Designs | - | - | - | - | - | - | - | - | - | - |
|
Maxim Integrated |
IC EAM DRIVER 10GBPS 24-TQFN |
Active | Driver | - | 1 | -5.5 V ~ -4.9 V | 140mA | - | -40°C ~ 85°C | Surface Mount | 24-WFQFN Exposed Pad | 24-TQFN (4x4) |
|
Microsemi Corporation |
IC CESOP PROCESSOR 128CH 324BGA |
Active | Telecom Circuit | TDM | 1 | 1.65 V ~ 1.95 V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
|
Maxim Integrated |
IC TXRX T1/E1 QUAD 256-BGA |
Not For New Designs | Transceiver | E1 | 4 | 3.3V | - | - | - | Surface Mount | 256-BGA | 256-BGA (27x27) |
|
Maxim Integrated |
IC TXRX E1 QUAD 256BGA |
Not For New Designs | Transceiver | E1 | 4 | 5V | - | - | - | Surface Mount | 256-BGA | 256-BGA (27x27) |
|
Microsemi Corporation |
32 LINK 256 HDLC CHANNEL FRAME |
Not For New Designs | - | - | - | - | - | - | - | - | - | - |
|
Microsemi Corporation |
JAGUAR-1 24X1G4X10G CARRIER ET |
Active | - | - | - | - | - | - | - | - | - | - |
|
Microsemi Corporation |
DUAL/QUAD 10GBE PHY W/OTN-FEC |
Not For New Designs | - | - | - | - | - | - | - | - | - | - |
|
Microsemi Corporation |
DUAL/QUAD 10GE PHY W/OTN-FEC |
Not For New Designs | - | - | - | - | - | - | - | - | - | - |
|
Microsemi Corporation |
32 CHANNEL T1/E1 FRAMER |
Not For New Designs | - | - | - | - | - | - | - | - | - | - |
|
Microsemi Corporation |
IC DGTL SWITCH F16KDX 272BGA |
Active | Switch | - | 1 | 3 V ~ 3.6 V | 160mA | - | -40°C ~ 85°C | Surface Mount | 272-BGA | 272-PBGA (27x27) |
|
Microsemi Corporation |
TELECOM INTERFACE ICS 32 LINK |
Not For New Designs | - | - | - | - | - | - | - | - | - | - |
|
Microsemi Corporation |
DUAL/QUAD 10GBE UNIV PHY W/OTN-F |
Not For New Designs | - | - | - | - | - | - | - | - | - | - |
|
Microsemi Corporation |
IC CESOP PROC 256CH 552BGA |
Active | Telecom Circuit | TDM | 1 | 1.65 V ~ 1.95 V | 950mA | - | -40°C ~ 85°C | Surface Mount | 552-BGA | 552-PBGA (35x35) |
|
Microsemi Corporation |
4X10GE TRANSCEIVER WITH OTN-FEC |
Active | - | - | - | - | - | - | - | - | - | - |
|
Microsemi Corporation |
12X1G 24X1G OR 24X1G 2X10G |
Active | - | - | - | - | - | - | - | - | - | - |
|
Maxim Integrated |
IC TXRX QUAD E1 3.3V 256-BGA |
Not For New Designs | Transceiver | E1 | 4 | 3.3V | - | - | - | Surface Mount | 256-BGA | 256-BGA (27x27) |
|
Microsemi Corporation |
SINGLE-CHIP SONET/SDH TRANSPORT |
Not For New Designs | - | - | - | - | - | - | - | - | - | - |
|
MaxLinear, Inc. |
IC LIU E3/DS3/STS-1 12CH 420TBGA |
Active | Line Interface Unit (LIU) | LIU | 12 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 420-LBGA | 420-TBGA (35x35) |
|
Microsemi Corporation |
24X1G 4X10G OR 48X1G 2X10G |
Active | - | - | - | - | - | - | - | - | - | - |
|
Microsemi Corporation |
HIGH DENSITY FRAMER/MAPPER FOR 8 |
Not For New Designs | - | - | - | - | - | - | - | - | - | - |
|
Microsemi Corporation |
TEMAP 84FDL GREEN DUAL PASSIVATI |
Not For New Designs | - | - | - | - | - | - | - | - | - | - |
|
Maxim Integrated |
IC TDM PACKET 32PORT 676PBGA |
Not For New Designs | TDM-over-Packet (TDMoP) | TDMoP | 1 | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 676-BGA | 676-TEPBGA (27x27) |
|
Microsemi Corporation |
ARROW M8XFE |
Not For New Designs | - | - | - | - | - | - | - | - | - | - |
|
Microsemi Corporation |
IC CESOP PROCESSOR 552BGA |
Active | Telecom Circuit | TDM | 1 | 1.65 V ~ 1.95 V | 950mA | - | -40°C ~ 85°C | Surface Mount | 552-BGA | 552-PBGA (35x35) |
|
Microsemi Corporation |
HIGH DENSITY FRAMER/MAPPER FOR 8 |
Not For New Designs | - | - | - | - | - | - | - | - | - | - |
|
Microsemi Corporation |
DUAL/QUAD 10GBE UNIV PHY W/OTN-F |
Not For New Designs | - | - | - | - | - | - | - | - | - | - |
|
Microsemi Corporation |
TEMAP 84FDL LF BUMP |
Not For New Designs | - | - | - | - | - | - | - | - | - | - |
|
Microsemi Corporation |
ARROW 24XFE PB FREE |
Not For New Designs | - | - | - | - | - | - | - | - | - | - |
|
Microsemi Corporation |
TEMAP 168 LF BUMP |
Active | - | - | - | - | - | - | - | - | - | - |
|
Microsemi Corporation |
TEMUX-84 WITH E3 MAPPERS DS3/E3 |
Not For New Designs | Framer | E1, J1, T1 | - | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 324-FBGA | 324-PBGA (23x23) |
|
Microsemi Corporation |
TEMUX-84 WITH E3 MAPPERS DS3/E3 |
Not For New Designs | Framer | E1, J1, T1 | - | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 324-FBGA | 324-PBGA (23x23) |
|
Microsemi Corporation |
IC CESOP PROC 1024CH 552BGA |
Active | Telecom Circuit | TDM | 1 | 1.65 V ~ 1.95 V | 950mA | - | -40°C ~ 85°C | Surface Mount | 552-BGA | 552-PBGA (35x35) |
|
Microsemi Corporation |
ARROW 2XGE PB FREE |
Not For New Designs | - | - | - | - | - | - | - | - | - | - |
|
Microsemi Corporation |
ARROW 2XGE PB FREE |
Active | - | - | - | - | - | - | - | - | - | - |
|
Microsemi Corporation |
ARROW 2XGE |
Not For New Designs | - | - | - | - | - | - | - | - | - | - |
|
Microsemi Corporation |
84/63 CHANNEL T1/E1 FRAMER DEVIC |
Not For New Designs | - | - | - | - | - | - | - | - | - | - |
|
Microsemi Corporation |
84/63 CHANNEL T1/E1 FRAMER DEVIC |
Not For New Designs | - | - | - | - | - | - | - | - | - | - |
|
MaxLinear, Inc. |
IC LIU LH/SH T1/E1 SGL 64TQFP |
Active | Line Interface Unit (LIU) | LIU | 1 | 3.135 V ~ 3.465 V | - | - | - | - | - | - |
|
MaxLinear, Inc. |
IC LIU LH/SH T1/E1 SGL 64TQFP |
Active | Transceiver | - | 1 | 3.135 V ~ 3.465 V | - | - | - | - | - | - |
|
Microsemi Corporation |
ARROW 24XFE |
Not For New Designs | - | - | - | - | - | - | - | - | - | - |
|
Microsemi Corporation |
ARROW 2488 PB FREE |
Active | - | - | - | - | - | - | - | - | - | - |
|
Microsemi Corporation |
TEMUX 168 PB FREE |
Not For New Designs | - | - | - | - | - | - | - | - | - | - |
|
Microsemi Corporation |
ARROW 2488 PB FREE |
Active | - | - | - | - | - | - | - | - | - | - |
|
Microsemi Corporation |
TSE-120 PB FREE |
Not For New Designs | - | - | - | - | - | - | - | - | - | - |
|
Microsemi Corporation |
PM5324 ARROW-1X192 |
Not For New Designs | SONET/SDH | SFI-4 | - | 1.2V | - | - | - | Surface Mount | 1292-BGA, FCBGA | 1292-FCBGA |
|
Microsemi Corporation |
TSE-120 |
Not For New Designs | - | - | - | - | - | - | - | - | - | - |
|
Microsemi Corporation |
TSE-240 PB FREE |
Not For New Designs | - | - | - | - | - | - | - | - | - | - |