|
|
IDT, Integrated Device Technology Inc |
IC LIU T1/E1/J1 OCTAL 256BGA |
Active | Line Interface Unit (LIU) | E1, J1, T1 | 8 | 1.8V, 3.3V | - | 2.57W | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-PBGA (17x17) |
|
|
Maxim Integrated |
IC LIU DS3/E3/STS-1 484-BGA |
Obsolete | Line Interface Unit (LIU) | LIU | - | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 484-BGA | 484-BGA (23x23) |
|
|
Maxim Integrated |
IC TDM OVER PACKET 676-BGA |
Active | TDM-over-Packet (TDMoP) | TDMoP | 1 | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 676-BGA | 676-TEPBGA (27x27) |
|
|
Microsemi Corporation |
EIGHT CHANNEL COMBINED T1/E1/J1 |
Active | Transceiver | E1, J1, SPI, T1 | 8 | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-CABGA (17x17) |
|
|
Microsemi Corporation |
FOUR CHANNEL COMBINED T1/E1/J1 T |
Not For New Designs | Transceiver | E1, J1, SPI, T1 | 4 | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-CABGA (17x17) |
|
|
Microsemi Corporation |
TEMUX-84 WITH E3 MAPPERS DS3/E3 |
Not For New Designs | Framer | E1, J1, T1 | - | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 324-FBGA | 324-PBGA (23x23) |
|
|
MaxLinear, Inc. |
IC LIU/FRAMER 256PBGA |
Active | Framer, Line Interface Unit (LIU) | E1, J1, T1 | 1 | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 256-FBGA | 256-FPBGA (17x17) |
