|  | NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | Active | e200z4 | 32-Bit Dual-Core | 120MHz | CANbus, FlexRay, LINbus, SPI, UART/USART | DMA, POR, PWM, WDT | - | 1MB (1M x 8) | FLASH | - | 128K x 8 | 3 V ~ 5.5 V | A/D 32x12b | Internal | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | 
                    
                |  | NXP USA Inc. | DUAL CORE 3M FLASH 256 | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 
                    
                |  | NXP USA Inc. | 32 BIT DUAL CORE 3M FLASH 384 | Active | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | 
                    
                |  | NXP USA Inc. | 32 BIT DUAL CORE 3M FLASH 384 | Active | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | 
                    
                |  | XMOS | IC MCU 32BIT ROMLESS 374FBGA | Active | XCore | 32-Bit 24-Core | 4000MIPS | - | - | 176 | - | ROMless | - | 512K x 8 | 0.95 V ~ 3.6 V | - | External | 0°C ~ 70°C (TA) | 374-LFBGA | 374-FBGA (18x18) | 
                    
                |  | NXP USA Inc. | IC MCU 32BIT 3MB FLASH 256MAPBGA | Active | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | 
                    
                |  | NXP USA Inc. | DUAL CORE 3M FLASH 384K RAM F | Active | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | 
                    
                |  | NXP USA Inc. | IC MCU 16BIT 128KB FLASH 112LQFP | Active | HCS12 | 16-Bit | 25MHz | CANbus, I²C, SCI, SPI | PWM, WDT | 91 | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | 
                    
                |  | NXP USA Inc. | IC MCU 32BIT 1.5MB FLASH 144LQFP | Active | e200z3 | 32-Bit | 80MHz | CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART | DMA, POR, PWM, WDT | 80 | 1.5MB (1.5M x 8) | FLASH | - | 94K x 8 | 4.5 V ~ 5.25 V | A/D 32x12b | Internal | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | 
                    
                |  | NXP USA Inc. | IC MCU 16BIT 256KB FLASH 112LQFP | Not For New Designs | HCS12 | 16-Bit | 25MHz | CANbus, EBI/EMI, I²C, SCI, SPI | LCD, Motor control PWM, POR, PWM, WDT | 85 | 256KB (256K x 8) | FLASH | 2K x 8 | 12K x 8 | 2.35 V ~ 5.5 V | A/D 16x10b | Internal | -40°C ~ 105°C (TA) | 112-LQFP | 112-LQFP (20x20) | 
                    
                |  | NXP USA Inc. | ETHERNET CAMERA MCU | Active | e200z0h | 32-Bit | 64MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, WDT | 39 | 512KB (512K x 8) | FLASH | 64K x 8 | 96K x 8 | 3 V ~ 3.6 V | A/D 4x10b | Internal | -40°C ~ 105°C (TA) | 121-LFBGA | 121-MAPBGA (8x8) | 
                    
                |  | NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | Active | e200z4 | 32-Bit Dual-Core | 120MHz | CANbus, FlexRay, LINbus, SPI, UART/USART | DMA, POR, PWM, WDT | - | 1MB (1M x 8) | FLASH | - | 128K x 8 | 3 V ~ 5.5 V | A/D 32x12b | Internal | -40°C ~ 125°C (TA) | 257-LFBGA | 257-MAPBGA (14x14) | 
                    
                |  | NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | Active | e200z4 | 32-Bit Dual-Core | 120MHz | CANbus, FlexRay, LINbus, SPI, UART/USART | DMA, POR, PWM, WDT | - | 1MB (1M x 8) | FLASH | - | 128K x 8 | 3 V ~ 5.5 V | A/D 32x12b | Internal | -40°C ~ 125°C (TA) | 257-LFBGA | 257-MAPBGA (14x14) | 
                    
                |  | NXP USA Inc. | IC MCU 16BIT 128KB FLASH 112LQFP | Active | HCS12 | 16-Bit | 25MHz | CANbus, I²C, SCI, SPI | PWM, WDT | 91 | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | -40°C ~ 105°C (TA) | 112-LQFP | 112-LQFP (20x20) | 
                    
                |  | NXP USA Inc. | IC MCU 16BIT ROMLESS 144LQFP | Not For New Designs | CPU16 | 16-Bit | 20MHz | EBI/EMI, SCI, SPI | POR, PWM, WDT | 16 | - | ROMless | - | 1K x 8 | 2.7 V ~ 5.5 V | A/D 8x10b | Internal | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | 
                    
                |  | XMOS | IC MCU 32BIT ROMLESS 374FBGA | Active | XCore | 32-Bit 24-Core | 4000MIPS | USB | - | 176 | - | ROMless | - | 1M x 8 | 0.95 V ~ 3.6 V | - | External | -40°C ~ 85°C (TA) | 374-LFBGA | 374-FBGA (18x18) | 
                    
                |  | XMOS | IC MCU 32BIT 2MB FLASH 324FBGA | Active | XCore | 32-Bit 24-Core | 4000MIPS | USB | - | 208 | 2MB (2M x 8) | FLASH | - | 1M x 8 | 0.95 V ~ 3.6 V | - | External | -40°C ~ 85°C (TA) | 324-FBGA | 324-FBGA (15x15) | 
                    
                |  | NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 384 | Active | e200z4 | 32-Bit | 120MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | - | 3MB (3M x 8) | FLASH | 64K x 8 | 384K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b, 16x12b | Internal | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | 
                    
                |  | NXP USA Inc. | SINGLE CORE 3M FLASH 384K RAM | Active | e200z4 | 32-Bit | 120MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | - | 3MB (3M x 8) | FLASH | 64K x 8 | 384K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b, 16x12b | Internal | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | 
                    
                |  | NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | Active | e200z3 | 32-Bit | 80MHz | CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART | DMA, POR, PWM, WDT | 80 | 1MB (1M x 8) | FLASH | - | 64K x 8 | 4.5 V ~ 5.25 V | A/D 34x12b | Internal | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | 
                    
                |  | NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | Active | e200z0, e200z1 | 32-Bit Dual-Core | 66MHz | CANbus, EBI/EMI, I²C, SCI, SPI | DMA, POR, PWM, WDT | 111 | 1MB (1M x 8) | FLASH | - | 64K x 8 | 4.5 V ~ 5.25 V | A/D 40x12b | Internal | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | 
                    
                |  | NXP USA Inc. | DUAL CORE 2M FLASH | Active | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz, 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | - | 2MB (2M x 8) | FLASH | 64K x 8 | 256K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b, 16x12b | Internal | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | 
                    
                |  | NXP USA Inc. | 32 BIT3M FLASH384 RAM | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 
                    
                |  | NXP USA Inc. | 3 CAN 512 FLASH 32K RAM | Active | HCS12X | 16-Bit | 80MHz | CANbus, I²C, SCI, SPI | LVD, POR, PWM, WDT | 59 | 512KB (512K x 8) | FLASH | 4K x 8 | 32K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b, 16x10b | External | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | 
                    
                |  | NXP USA Inc. | 16-BIT MCU S12 CORE 256KB FLASH | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 
                    
                |  | NXP USA Inc. | IC MCU 16BIT 256KB FLASH 144LQFP | Not For New Designs | HCS12 | 16-Bit | 16MHz | CANbus, I²C, SCI, SPI | LCD, POR, PWM, WDT | 99 | 256KB (256K x 8) | FLASH | 4K x 8 | 12K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | 
                    
                |  | NXP USA Inc. | IC MCU 16BIT 256KB FLASH 144LQFP | Not For New Designs | HCS12 | 16-Bit | 50MHz | CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART | LCD, LVD, POR, PWM, WDT | 117 | 256KB (256K x 8) | FLASH | 2K x 8 | 12K x 8 | 4.5 V ~ 5.5 V | A/D 16x10b | Internal | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | 
                    
                |  | XMOS | IC MCU 32BIT 2MB FLASH 374FBGA | Active | XCore | 32-Bit 24-Core | 4000MIPS | - | - | 176 | 2MB (2M x 8) | FLASH | - | 1M x 8 | 0.95 V ~ 3.6 V | - | External | -40°C ~ 85°C (TA) | 374-LFBGA | 374-FBGA (18x18) | 
                    
                |  | XMOS | IC MCU 32BIT 128KB SRAM 124QFN | Active | XCore | 32-Bit Dual-Core | 500MIPS | Configurable | - | 84 | 128KB (32K x 32) | SRAM | - | - | 0.95 V ~ 3.6 V | - | External | 0°C ~ 70°C (TA) | 124-TFQFN Dual Rows, Exposed Pad | 124-QFN DualRow (10x10) | 
                    
                |  | NXP USA Inc. | ETHERNET CAMERA MCU | Active | e200z0h | 32-Bit | 64MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, WDT | 39 | 512KB (512K x 8) | FLASH | 64K x 8 | 96K x 8 | 3 V ~ 3.6 V | A/D 4x10b | Internal | -40°C ~ 105°C (TA) | 121-LFBGA | 121-MAPBGA (8x8) | 
                    
                |  | NXP USA Inc. | IC MCU 32BIT ROMLESS 256MAPBGA | Not For New Designs | Coldfire V3 | 32-Bit | 240MHz | CANbus, EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG | DMA, LCD, PWM, WDT | 94 | - | ROMless | - | 32K x 8 | 1.4 V ~ 3.6 V | - | External | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPBGA | 
                    
                |  | NXP USA Inc. | IC MCU 32BIT 1MB FLASH 257MAPBGA | Active | e200z4 | 32-Bit Dual-Core | 120MHz | CANbus, FlexRay, LINbus, SPI, UART/USART | DMA, POR, PWM, WDT | - | 1MB (1M x 8) | FLASH | - | 128K x 8 | 3 V ~ 5.5 V | A/D 32x12b | Internal | -40°C ~ 125°C (TA) | 257-LFBGA | 257-MAPBGA (14x14) | 
                    
                |  | NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | Active | e200z4 | 32-Bit Dual-Core | 120MHz | CANbus, FlexRay, LINbus, SPI, UART/USART | DMA, POR, PWM, WDT | - | 1MB (1M x 8) | FLASH | - | 128K x 8 | 3 V ~ 5.5 V | A/D 32x12b | Internal | -40°C ~ 125°C (TA) | 257-LFBGA | 257-MAPBGA (14x14) | 
                    
                |  | NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | Active | e200z4 | 32-Bit Dual-Core | 120MHz | CANbus, FlexRay, LINbus, SPI, UART/USART | DMA, POR, PWM, WDT | - | 1MB (1M x 8) | FLASH | - | 128K x 8 | 3 V ~ 5.5 V | A/D 32x12b | Internal | -40°C ~ 125°C (TA) | 257-LFBGA | 257-MAPBGA (14x14) | 
                    
                |  | NXP USA Inc. | S12DG 16-BIT MCU HCS12 CORE 25 | Active | HCS12 | 16-Bit | 25MHz | CANbus, I²C, SCI, SPI | PWM, WDT | 59 | 256KB (256K x 8) | FLASH | 4K x 8 | 12K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | 
                    
                |  | NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | Active | e200z4 | 32-Bit | 80MHz | CANbus, EBI/EMI, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 84 | 2MB (2M x 8) | FLASH | - | 128K x 8 | 1.14 V ~ 5.25 V | A/D 40x12b | Internal | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | 
                    
                |  | NXP USA Inc. | IC MCU 32BIT 4MB FLASH 256MAPBGA | Active | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | 
                    
                |  | NXP USA Inc. | 32 BIT DUAL CORE 3M FLASH 512K R | Active | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | - | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | 100-LFBGA | 100-MAPBGA (11x11) | 
                    
                |  | NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | Active | e200z0, e200z1 | 32-Bit Dual-Core | 66MHz | CANbus, EBI/EMI, I²C, SCI, SPI | DMA, POR, PWM, WDT | 111 | 1MB (1M x 8) | FLASH | - | 64K x 8 | 4.5 V ~ 5.25 V | A/D 40x12b | Internal | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | 
                    
                |  | NXP USA Inc. | 32 BIT DUAL CORE 3M FLASH 512 | Active | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | - | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | 100-LFBGA | 100-MAPBGA (11x11) | 
                    
                |  | NXP USA Inc. | IC MCU 16BIT 64KB FLASH 128LQFP | Active | 56800E | 16-Bit | 60MHz | CANbus, EBI/EMI, SCI, SPI | POR, PWM, Temp Sensor, WDT | 49 | 64KB (32K x 16) | FLASH | - | 6K x 16 | 2.25 V ~ 3.6 V | A/D 16x12b | External | -40°C ~ 125°C (TA) | 128-LQFP | 128-LQFP (14x20) | 
                    
                |  | NXP USA Inc. | ETHERNET CAMERA MCU | Active | e200z0h | 32-Bit | 64MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, WDT | 39 | 512KB (512K x 8) | FLASH | 64K x 8 | 96K x 8 | 3 V ~ 3.6 V | A/D 4x10b | Internal | -40°C ~ 105°C (TA) | 121-LFBGA | 121-MAPBGA (8x8) | 
                    
                |  | NXP USA Inc. | 32 BIT DUAL CORE 3M FLASH 384 | Active | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | 
                    
                |  | NXP USA Inc. | 32 BIT DUAL CORE 3M FLASH 384 | Active | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | 
                    
                |  | NXP USA Inc. | IC MCU 16BIT 256KB FLASH 144LQFP | Not For New Designs | HCS12 | 16-Bit | 16MHz | CANbus, I²C, SCI, SPI | LCD, POR, PWM, WDT | 99 | 256KB (256K x 8) | FLASH | 4K x 8 | 12K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | 
                    
                |  | NXP USA Inc. | IC MCU 32BIT 1.5MB FLASH 176LQFP | Active | e200z3 | 32-Bit | 80MHz | CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART | DMA, POR, PWM, WDT | 80 | 1.5MB (1.5M x 8) | FLASH | - | 94K x 8 | 4.5 V ~ 5.25 V | A/D 34x12b | Internal | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | 
                    
                |  | XMOS | IC MCU 32BIT 2MB FLASH 324FBGA | Active | XCore | 32-Bit 32-Core | 4000MIPS | USB | - | 208 | 2MB (2M x 8) | FLASH | - | 512K x 8 | 0.95 V ~ 3.6 V | - | External | 0°C ~ 70°C (TA) | 324-FBGA | 324-FBGA (15x15) | 
                    
                |  | NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | Active | e200z4d, e200z0h | 32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 85°C (TA) | 176-LQFP | 176-LQFP (24x24) | 
                    
                |  | NXP USA Inc. | NXP 32-BIT MCU POWER ARCH 1.5M | Active | e200z4d | 32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 128K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | 
                    
                |  | NXP USA Inc. | NXP 32-BIT MCU POWER ARCH 1.5M | Active | e200z4d | 32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 128K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) |