Passive Components components availability and price - Passive Components Distributor - CHIPSIC

Part Number	Manufacturer / Brand	Brife Description
K4H510838D-LB0	SAMSUNG	512Mb D-die DDR SDRAM Specification 66 TSOP-II with Pb-Free RoHS compliant
K4H511638D-UCC	SAMSUNG	512Mb D-die DDR SDRAM Specification 66 TSOP-II with Pb-Free RoHS compliant
K4H510838D-LA2	SAMSUNG	512Mb D-die DDR SDRAM Specification 66 TSOP-II with Pb-Free RoHS compliant
M368L2923DUN-CCC	SAMSUNG	DDR SDRAM Unbuffered Module 184pin Unbuffered Module based on 512Mb D-die with 64/72-bit Non ECC/ECC 66 TSOP-II with Pb-Free RoHS compliant
M368L2923DUN-CB3	SAMSUNG	DDR SDRAM Unbuffered Module 184pin Unbuffered Module based on 512Mb D-die with 64/72-bit Non ECC/ECC 66 TSOP-II with Pb-Free RoHS compliant
M374S6553BTS-C7A	SAMSUNG	SDRAM Unbuffered Module 168pin Unbuffered Module based on 512Mb B-die 62/72-bit Non ECC/ECC
K6F1016U4C-AF70	SAMSUNG	64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM
K6F1016U4C-AF55	SAMSUNG	64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM
CX6840	SAMSUNG	SCHEMATIC DIAGRAM
CX-6840	SAMSUNG	SCHEMATIC DIAGRAM
CX6837	SAMSUNG	SCHEMATIC DIAGRAM
CX-6837	SAMSUNG	SCHEMATIC DIAGRAM
KA2183	SAMSUNG	LINEAR INTEGRATED CIRCUIT
KA2182	SAMSUNG	LINEAR INTEGRATED CIRCUIT
K6R1008C1C-T15	SAMSUNG	128Kx8 Bit High-Speed CMOS Static RAM5V Operating. Operated at Commercial and Industrial Temperature Ranges.
KA2111	SAMSUNG	LINEAR INTEGRATED CIRCUIT
K4H510838B-VC/LCC	SAMSUNG	512Mb B-die DDR SDRAM Specification 54 sTSOP-II 400mil x 441mil
K4H510838B-VC/LB0	SAMSUNG	512Mb B-die DDR SDRAM Specification 54 sTSOP-II 400mil x 441mil
K4H510838B-VC/LB3	SAMSUNG	512Mb B-die DDR SDRAM Specification 54 sTSOP-II 400mil x 441mil
K4H510838B-NC/LCC	SAMSUNG	512Mb B-die DDR SDRAM Specification 54 sTSOP-II 400mil x 441mil
K4H510838B-VC/LA2	SAMSUNG	512Mb B-die DDR SDRAM Specification 54 sTSOP-II 400mil x 441mil
K4H510838B-NC/LB0	SAMSUNG	512Mb B-die DDR SDRAM Specification 54 sTSOP-II 400mil x 441mil
K4H510838B-NC/LB3	SAMSUNG	512Mb B-die DDR SDRAM Specification 54 sTSOP-II 400mil x 441mil
K4H510838B-N	SAMSUNG	512Mb B-die DDR SDRAM Specification 54 sTSOP-II 400mil x 441mil
K4H510838B-NC/LA2	SAMSUNG	512Mb B-die DDR SDRAM Specification 54 sTSOP-II 400mil x 441mil
IRFS634A	SAMSUNG	Advanced Power MOSEFT
M464S0924DTS-L7A	SAMSUNG	8Mx64 SDRAM SODIMM based on 8Mx16 4Banks 4K Refresh 3.3V Synchronous DRAMs with SPD
M464S0924DTS-L7C	SAMSUNG	8Mx64 SDRAM SODIMM based on 8Mx16 4Banks 4K Refresh 3.3V Synchronous DRAMs with SPD
M464S0924DTS-L1H	SAMSUNG	8Mx64 SDRAM SODIMM based on 8Mx16 4Banks 4K Refresh 3.3V Synchronous DRAMs with SPD
M464S0924DTS-L1L	SAMSUNG	8Mx64 SDRAM SODIMM based on 8Mx16 4Banks 4K Refresh 3.3V Synchronous DRAMs with SPD
M393T6453FZA-CE6/D5/CC	SAMSUNG	DDR2 Registered SDRAM MODULE 240pin Registered Module based on 256Mb F-die 72-bit ECC
M393T6453FZA-D5	SAMSUNG	DDR2 Registered SDRAM MODULE 240pin Registered Module based on 256Mb F-die 72-bit ECC
M378T3253FG0-CCC	SAMSUNG	DDR2 Unbuffered SDRAM MODULE
K6T1008C2C-TB70	SAMSUNG	128K x8 bit Low Power CMOS Static RAM
K6T1008C2C-TF70	SAMSUNG	128K x8 bit Low Power CMOS Static RAM
K6T1008C2C-TB55	SAMSUNG	128K x8 bit Low Power CMOS Static RAM
K4S64323LF-DG/S75	SAMSUNG	2Mx32 Mobile SDRAM 90FBGA
K4S64323LF-DG/S1H	SAMSUNG	2Mx32 Mobile SDRAM 90FBGA
K4S64323LF-DG/S1L	SAMSUNG	2Mx32 Mobile SDRAM 90FBGA
K4S64323LF-DG/S15	SAMSUNG	2Mx32 Mobile SDRAM 90FBGA
K6T8016C3M-TF55	SAMSUNG	512Kx16 bit Low Power CMOS Static RAM
K6T8016C3M-TF70	SAMSUNG	512Kx16 bit Low Power CMOS Static RAM
K6T8016C3M-TB70	SAMSUNG	512Kx16 bit Low Power CMOS Static RAM
K6R1004V1C-C	SAMSUNG	256Kx4 Bit with OE High-Speed CMOS Static RAM3.3V Operating.
S5D4100X	SAMSUNG	Digital Interface Including Scaler Image Enhancement
S3C89V5	SAMSUNG	8-BIT MICROCONTROLLER for SMART CARD
KS5211F	SAMSUNG	CMOS DIGITAL INTERGRATED CIRCUIT
KS5211E	SAMSUNG	CMOS DIGITAL INTERGRATED CIRCUIT
KS5211A	SAMSUNG	CMOS DIGITAL INTERGRATED CIRCUIT
KS5211	SAMSUNG	CMOS DIGITAL INTERGRATED CIRCUIT

Manufacturers for Passive Components