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NXP USA Inc. |
NXP 32-BIT MCU POWER ARCH CORE |
Active | e200z0h | 32-Bit | 64MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 149 | 768KB (768K x 8) | FLASH | 64K x 8 | 64K x 8 | 3 V ~ 5.5 V | A/D 29x10b, 5x12b | Internal | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) |
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XMOS |
IC MCU 32BIT ROMLESS 374FBGA |
Active | XCore | 32-Bit 24-Core | 4000MIPS | - | - | 176 | - | ROMless | - | 512K x 8 | 0.95 V ~ 3.6 V | - | External | -40°C ~ 85°C (TA) | 374-LFBGA | 374-FBGA (18x18) |
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NXP USA Inc. |
SINGLE CORE 3M FLASH |
Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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NXP USA Inc. |
SINGLE CORE 1.5M FLASH |
Active | e200z4 | 32-Bit | 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | - | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b, 16x12b | Internal | -40°C ~ 125°C (TA) | - | - |
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NXP USA Inc. |
IC MCU 16BIT 512KB FLASH 112LQFP |
Active | HCS12X | 16-Bit | 80MHz | EBI/EMI, I²C, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 91 | 512KB (512K x 8) | FLASH | 4K x 8 | 32K x 8 | 2.35 V ~ 5.5 V | A/D 16x10b | External | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) |
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XMOS |
IC MCU 32BIT ROMLESS 374FBGA |
Active | XCore | 32-Bit 24-Core | 4000MIPS | USB | - | 176 | - | ROMless | - | 1M x 8 | 0.95 V ~ 3.6 V | - | External | 0°C ~ 70°C (TA) | 374-LFBGA | 374-FBGA (18x18) |
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NXP USA Inc. |
IC MCU 32BIT ROMLESS 225MAPBGA |
Not For New Designs | Coldfire V2 | 32-Bit | 140MHz | CANbus, EBI/EMI, I²C, QSPI, UART/USART, USB OTG | DMA, WDT | - | - | ROMless | - | 128K x 8 | 1.08 V ~ 1.32 V | A/D 6x12b | External | -40°C ~ 85°C (TA) | 225-LFBGA | 225-MAPBGA (13x13) |
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NXP USA Inc. |
DUAL CORE 1.5M FLASH |
Active | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz, 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | - | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b, 16x12b | Internal | -40°C ~ 105°C (TA) | - | - |
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XMOS |
IC MCU 32BIT 2MB FLASH 324FBGA |
Active | XCore | 32-Bit 24-Core | 4000MIPS | USB | - | 208 | 2MB (2M x 8) | FLASH | - | 1M x 8 | 0.95 V ~ 3.6 V | - | External | 0°C ~ 70°C (TA) | 324-FBGA | 324-FBGA (15x15) |
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XMOS |
IC MCU 32BIT 2MB FLASH 324FBGA |
Active | XCore | 32-Bit 24-Core | 4000MIPS | USB | - | 208 | 2MB (2M x 8) | FLASH | - | 512K x 8 | 0.95 V ~ 3.6 V | - | External | -40°C ~ 85°C (TA) | 324-FBGA | 324-FBGA (15x15) |
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NXP USA Inc. |
IC MCU 16BIT 128KB FLASH 112LQFP |
Active | HCS12 | 16-Bit | 25MHz | CANbus, I²C, SCI, SPI | PWM, WDT | 91 | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) |
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XMOS |
IC MCU 32BIT 2MB FLASH 374FBGA |
Active | XCore | 32-Bit 24-Core | 4000MIPS | - | - | 176 | 2MB (2M x 8) | FLASH | - | 512K x 8 | 0.95 V ~ 3.6 V | - | External | -40°C ~ 85°C (TA) | 374-LFBGA | 374-FBGA (18x18) |
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NXP USA Inc. |
16-BIT MCU S12X CORE 768KB FLA |
Active | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 119 | 768KB (768K x 8) | FLASH | 4K x 8 | 48K x 8 | 1.72 V ~ 5.5 V | A/D 24x12b | External | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) |
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NXP USA Inc. |
16-BIT MCU S12X CORE 512KB FLA |
Active | HCS12X | 16-Bit | 80MHz | CANbus, I²C, SCI, SPI | LVD, POR, PWM, WDT | 91 | 512KB (512K x 8) | FLASH | 4K x 8 | 32K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b, 16x10b | External | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) |
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NXP USA Inc. |
IC MCU 16BIT 128KB FLASH 112LQFP |
Not For New Designs | HCS12 | 16-Bit | 25MHz | CANbus, I²C, SCI, SPI | PWM, WDT | 91 | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) |
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NXP USA Inc. |
32BIT 512K FLASH 48K RAM |
Active | e200z0h | 32-Bit | 64MHz | CANbus, I²C, LINbus, QSPI, SCI, SPI | DMA, LCD, POR, PWM, WDT | 105 | 512KB (512K x 8) | FLASH | 64K x 8 | 48K x 8 | 3 V ~ 5.5 V | A/D 16x10b | Internal | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) |
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NXP USA Inc. |
IC MCU 32BIT ROMLESS 144LQFP |
Not For New Designs | Coldfire V2 | 32-Bit | 120MHz | I²C, IDE, Memory Card, SPI, UART/USART | DMA, I²S, POR, Serial Audio, WDT | 34 | - | ROMless | - | 96K x 8 | 3 V ~ 3.6 V | A/D 4x12b | External | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) |
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NXP USA Inc. |
912XDP512J1 GENERAL |
Active | HCS12X | 16-Bit | 80MHz | CANbus, I²C, SCI, SPI | LVD, POR, PWM, WDT | 91 | 512KB (512K x 8) | FLASH | 4K x 8 | 32K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b, 16x10b | External | -40°C ~ 105°C (TA) | 112-LQFP | 112-LQFP (20x20) |
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NXP USA Inc. |
IC MCU 16BIT 128KB FLASH 112LQFP |
Not For New Designs | HCS12 | 16-Bit | 25MHz | CANbus, EBI/EMI, I²C, SCI, SPI | LCD, Motor control PWM, POR, PWM, WDT | 91 | 128KB (128K x 8) | FLASH | 2K x 8 | 6K x 8 | 2.35 V ~ 2.75 V | A/D 16x10b | Internal | -40°C ~ 105°C (TA) | 112-LQFP | 112-LQFP (20x20) |
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NXP USA Inc. |
SINGLE CORE 3M FLASH 384K RAM |
Active | e200z4 | 32-Bit | 120MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | - | 3MB (3M x 8) | FLASH | 64K x 8 | 384K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b, 16x12b | Internal | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
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NXP USA Inc. |
32 BIT SINGLE CORE 3M FLASH 3 |
Active | e200z4 | 32-Bit | 120MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | - | 3MB (3M x 8) | FLASH | 64K x 8 | 384K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b, 16x12b | Internal | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
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XMOS |
IC MCU 32BIT 2MB FLASH 374FBGA |
Active | XCore | 32-Bit 24-Core | 4000MIPS | - | - | 176 | 2MB (2M x 8) | FLASH | - | 1M x 8 | 0.95 V ~ 3.6 V | - | External | 0°C ~ 70°C (TA) | 374-LFBGA | 374-FBGA (18x18) |
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NXP USA Inc. |
SINGLE CORE 3M FLASH |
Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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NXP USA Inc. |
IC MCU 16BIT 128KB FLASH 112LQFP |
Not For New Designs | HCS12 | 16-Bit | 25MHz | CANbus, I²C, SCI, SPI | PWM, WDT | 91 | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | -40°C ~ 105°C (TA) | 112-LQFP | 112-LQFP (20x20) |
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NXP USA Inc. |
SINGLE CORE 3M FLASH 384K RAM |
Active | e200z4 | 32-Bit | 120MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | - | 3MB (3M x 8) | FLASH | 64K x 8 | 384K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b, 16x12b | Internal | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
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NXP USA Inc. |
NXP 32-BIT MCU DUAL POWER ARCH |
Active | e200z4 | 32-Bit Dual-Core | 120MHz | CANbus, FlexRay, LINbus, SPI, UART/USART | DMA, POR, PWM, WDT | - | 1MB (1M x 8) | FLASH | - | 128K x 8 | 3 V ~ 5.5 V | A/D 32x12b | Internal | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) |
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NXP USA Inc. |
NXP 32-BIT MCU DUAL POWER ARCH |
Active | e200z4 | 32-Bit Dual-Core | 120MHz | CANbus, FlexRay, LINbus, SPI, UART/USART | DMA, POR, PWM, WDT | - | 1MB (1M x 8) | FLASH | - | 128K x 8 | 3 V ~ 5.5 V | A/D 32x12b | Internal | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) |
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NXP USA Inc. |
16-BIT MCU S12X CORE 384KB FLA |
Active | HCS12X | 16-Bit | 80MHz | CANbus, I²C, SCI, SPI | LVD, POR, PWM, WDT | 91 | 384KB (384K x 8) | FLASH | 4K x 8 | 20K x 8 | 3.15 V ~ 5.5 V | A/D 16x12b | External | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) |
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NXP USA Inc. |
NXP 32-BIT MCU POWER ARCH CORE |
Active | e200z0h | 32-Bit | 64MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, WDT | 39 | 512KB (512K x 8) | FLASH | 64K x 8 | 96K x 8 | 3 V ~ 3.6 V | A/D 4x10b | Internal | -40°C ~ 125°C (TA) | 64-LQFP | 64-LQFP (10x10) |
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NXP USA Inc. |
NXP 32-BIT MCU POWER ARCH CORE |
Active | e200z3 | 32-Bit | 60MHz | CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART | DMA, POR, PWM, WDT | 80 | 1MB (1M x 8) | FLASH | - | 64K x 8 | 4.5 V ~ 5.25 V | A/D 32x12b | Internal | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) |
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NXP USA Inc. |
IC MCU 8BIT ROMLESS 52PLCC |
Not For New Designs | HC11 | 8-Bit | 2MHz | SCI, SPI | POR, WDT | 38 | - | ROMless | 512 x 8 | 512 x 8 | 4.5 V ~ 5.5 V | A/D 8x8b | Internal | -40°C ~ 85°C (TA) | 52-LCC (J-Lead) | 52-PLCC (19.1x19.1) |
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NXP USA Inc. |
IC MCU 16BIT 128KB FLASH 112LQFP |
Not For New Designs | HCS12 | 16-Bit | 25MHz | CANbus, I²C, SCI, SPI | PWM, WDT | 91 | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) |
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NXP USA Inc. |
IC MCU 32BIT ROMLESS 360PBGA |
Active | Coldfire V4 | 32-Bit | 266MHz | I²C, SPI, SSI, UART/USART, USB OTG | DMA, WDT | 132 | - | ROMless | - | 32K x 8 | 1.35 V ~ 3.6 V | - | Internal | 0°C ~ 70°C (TA) | 360-BBGA | 360-PBGA (23x23) |
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NXP USA Inc. |
IC MCU 16BIT 128KB FLASH 112LQFP |
Active | HCS12 | 16-Bit | 25MHz | CANbus, I²C, SCI, SPI | PWM, WDT | 91 | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | -40°C ~ 105°C (TA) | 112-LQFP | 112-LQFP (20x20) |
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XMOS |
IC MCU 32BIT 128KB SRAM 217FBGA |
Active | XCore | 32-Bit 10-Core | 800MIPS | Configurable | - | 90 | 128KB (32K x 32) | SRAM | - | - | 0.90 V ~ 5.5 V | A/D 8x12b | Internal | -40°C ~ 85°C (TA) | 217-LFBGA | 217-FBGA (16x16) |
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NXP USA Inc. |
IC MCU 16BIT 128KB FLASH 80QFP |
Active | HCS12 | 16-Bit | 25MHz | CANbus, I²C, SCI, SPI | PWM, WDT | 59 | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | -40°C ~ 105°C (TA) | 80-QFP | 80-QFP (14x14) |
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NXP USA Inc. |
32 BIT DUAL CORE 3M FLASH 384 |
Active | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
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NXP USA Inc. |
NXP 32-BIT MCU DUAL CORE 3MB FLA |
Active | e200z4 | 32-Bit | 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | - | 3MB (3M x 8) | FLASH | 64K x 8 | 384K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b, 16x12b | Internal | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) |
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NXP USA Inc. |
SINGLE CORE 2M FLASH |
Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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NXP USA Inc. |
IC MCU 16BIT 256KB FLASH 80QFP |
Active | HCS12X | 16-Bit | 80MHz | CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 59 | 256KB (256K x 8) | FLASH | 4K x 8 | 14K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b | External | -40°C ~ 125°C (TA) | 80-QFP | 80-QFP (14x14) |
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NXP USA Inc. |
16-BIT MCU S12X CORE 512KB FLA |
Active | HCS12X | 16-Bit | 80MHz | CANbus, I²C, SCI, SPI | LVD, POR, PWM, WDT | 119 | 512KB (512K x 8) | FLASH | 4K x 8 | 32K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b, 16x10b | External | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) |
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XMOS |
IC MCU 32BIT ROMLESS 324FBGA |
Active | XCore | 32-Bit 24-Core | 4000MIPS | USB | - | 208 | - | ROMless | - | 1M x 8 | 0.95 V ~ 3.6 V | - | External | -40°C ~ 85°C (TA) | 324-FBGA | 324-FBGA (15x15) |
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NXP USA Inc. |
NXP 32-BIT MCU DUAL POWER ARCH |
Active | e200z4 | 32-Bit Dual-Core | 120MHz | CANbus, FlexRay, LINbus, SPI, UART/USART | DMA, POR, PWM, WDT | - | 1MB (1M x 8) | FLASH | - | 128K x 8 | 3 V ~ 5.5 V | A/D 32x12b | Internal | -40°C ~ 125°C (TA) | 257-LFBGA | 257-MAPBGA (14x14) |
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NXP USA Inc. |
NXP 32-BIT MCU DUAL POWER ARCH |
Active | e200z4 | 32-Bit Dual-Core | 120MHz | CANbus, FlexRay, LINbus, SPI, UART/USART | DMA, POR, PWM, WDT | - | 1MB (1M x 8) | FLASH | - | 128K x 8 | 3 V ~ 5.5 V | A/D 32x12b | Internal | -40°C ~ 125°C (TA) | 257-LFBGA | 257-MAPBGA (14x14) |
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NXP USA Inc. |
IC MCU 32BIT 3MB FLASH 100MAPBGA |
Active | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | - | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | 100-LFBGA | 100-MAPBGA (11x11) |
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NXP USA Inc. |
32 BIT DUAL CORE 3M FLASH 384 |
Active | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | - | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | 100-LFBGA | 100-MAPBGA (11x11) |
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NXP USA Inc. |
32 BIT SINGLE CORE 3M FLASH 384 |
Active | e200z4 | 32-Bit | 120MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | - | 3MB (3M x 8) | FLASH | 64K x 8 | 384K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b, 16x12b | Internal | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
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NXP USA Inc. |
SINGLE CORE 3M FLASH 384K RAM |
Active | e200z4 | 32-Bit | 120MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | - | 3MB (3M x 8) | FLASH | 64K x 8 | 384K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b, 16x12b | Internal | -40°C ~ 125°C (TA) | - | - |
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NXP USA Inc. |
IC MCU 32BIT 1MB FLASH 208MAPBGA |
Active | e200z0, e200z1 | 32-Bit Dual-Core | 48MHz | CANbus, EBI/EMI, I²C, SCI, SPI | DMA, POR, PWM, WDT | 144 | 1MB (1M x 8) | FLASH | - | 64K x 8 | 4.5 V ~ 5.25 V | A/D 40x12b | Internal | -40°C ~ 85°C (TA) | 208-BGA | 208-MAPBGA (17x17) |
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XMOS |
IC MCU 32BIT ROMLESS 374FBGA |
Active | XCore | 32-Bit 24-Core | 4000MIPS | - | - | 176 | - | ROMless | - | 1M x 8 | 0.95 V ~ 3.6 V | - | External | -40°C ~ 85°C (TA) | 374-LFBGA | 374-FBGA (18x18) |
