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NXP USA Inc. |
DUAL CORE 3M FLASH 384 |
Active | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) |
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NXP USA Inc. |
DUAL CORE 2M FLASH 256 |
Active | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz, 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | - | 2MB (2M x 8) | FLASH | 64K x 8 | 256K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b, 16x12b | Internal | -40°C ~ 125°C (TA) | - | - |
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NXP USA Inc. |
32 BIT SINGLE CORE 3M FLASH 3 |
Active | e200z4 | 32-Bit | 120MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | - | 3MB (3M x 8) | FLASH | 64K x 8 | 384K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b, 16x12b | Internal | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
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NXP USA Inc. |
IC MCU 16BIT ROMLESS 144LQFP |
Not For New Designs | CPU16 | 16-Bit | 25MHz | EBI/EMI, SCI, SPI | POR, PWM, WDT | 16 | - | ROMless | - | 1K x 8 | 2.7 V ~ 5.5 V | A/D 8x10b | Internal | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) |
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NXP USA Inc. |
IC MCU 16BIT ROMLESS 144LQFP |
Not For New Designs | CPU16 | 16-Bit | 16MHz | EBI/EMI, SCI, SPI | POR, PWM, WDT | 16 | - | ROMless | - | 1K x 8 | 2.7 V ~ 5.5 V | A/D 8x10b | Internal | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) |
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NXP USA Inc. |
IC MCU 16BIT ROMLESS 144LQFP |
Not For New Designs | CPU16 | 16-Bit | 16MHz | EBI/EMI, SCI, SPI | POR, PWM, WDT | 16 | - | ROMless | - | 1K x 8 | 2.7 V ~ 5.5 V | A/D 8x10b | Internal | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) |
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NXP USA Inc. |
DUAL CORE 3M FLASH 384K RAM F |
Active | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
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NXP USA Inc. |
IC MCU 32BIT ROMLESS 324TEPBGA |
Active | e300 | 32-Bit | 400MHz | CANbus, EBI/EMI, Ethernet, I²C, USB OTG | DMA, WDT | 64 | - | ROMless | - | 32K x 8 | 1.08 V ~ 3.6 V | - | External | -40°C ~ 125°C (TJ) | 324-BBGA | 324-TEPBGA (23x23) |
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NXP USA Inc. |
IC MCU 32BIT ROMLESS 324BGA |
Active | e300 | 32-Bit | 400MHz | CANbus, EBI/EMI, Ethernet, I²C, USB OTG | DMA, WDT | 64 | - | ROMless | - | 32K x 8 | 1.08 V ~ 3.6 V | - | External | -40°C ~ 125°C (TJ) | 324-BBGA | 324-PBGA (23x23) |
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NXP USA Inc. |
IC MCU 16BIT 128KB FLASH 144LQFP |
Not For New Designs | HCS12 | 16-Bit | 16MHz | CANbus, I²C, SCI, SPI | LCD, POR, PWM, WDT | 99 | 128KB (128K x 8) | FLASH | 4K x 8 | 6K x 8 | 2.35 V ~ 5.25 V | A/D 8x10b | Internal | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) |
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NXP USA Inc. |
32 BITDUAL CORE3M FLASH384 RA |
Active | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
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NXP USA Inc. |
32 BITDUAL CORE3M FLASH384 RA |
Active | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
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NXP USA Inc. |
IC MCU 32BIT 1MB FLASH 144LQFP |
Active | e200z0, e200z1 | 32-Bit Dual-Core | 66MHz | CANbus, EBI/EMI, I²C, SCI, SPI | DMA, POR, PWM, WDT | 111 | 1MB (1M x 8) | FLASH | - | 64K x 8 | 4.5 V ~ 5.25 V | A/D 40x12b | Internal | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) |
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NXP USA Inc. |
IC MCU 32BIT ROMLESS 196MAPBGA |
Not For New Designs | Coldfire V2 | 32-Bit | 166MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB | DMA, WDT | 69 | - | ROMless | - | 64K x 8 | 1.4 V ~ 1.6 V | - | External | -40°C ~ 85°C (TA) | 196-LBGA | 196-MAPBGA (15x15) |
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NXP USA Inc. |
IC MCU 32BIT 3MB FLASH 256MAPBGA |
Active | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) |
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NXP USA Inc. |
DUAL CORE 3M FLASH 384K RAM F |
Active | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) |
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NXP USA Inc. |
ARM 32-BIT MCU TRIPLE CORE 2MB |
Active | ARM® Cortex®-A5, -M4, -M0+ | 32-Bit Tri-Core | 80MHz, 160MHz, 320MHz | CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI | DMA, LCD, LVD/HVD, POR, PWM, WDT | - | 2MB (2M x 8) | FLASH | - | 2.3M x 8 | 3.15 V ~ 5.5 V | A/D 24x12b | Internal | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-LQFP (28x28) |
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NXP USA Inc. |
NXP 32-BIT MCU DUAL POWER ARCH |
Active | e200z4 | 32-Bit Dual-Core | 200MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI, UART/USART | DMA, LVD, POR, Zipwire | - | 2MB (2M x 8) | FLASH | - | 128K x 8 | 3.5 V ~ 5.5 V | A/D 12b SAR, 16b Sigma-Delta | Internal | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) |
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NXP USA Inc. |
IC MCU 32BIT ROMLESS 196MAPBGA |
Not For New Designs | Coldfire V2 | 32-Bit | 166MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB | DMA, WDT | 61 | - | ROMless | - | 64K x 8 | 1.4 V ~ 1.6 V | - | External | -40°C ~ 85°C (TA) | 196-LBGA | 196-MAPBGA (15x15) |
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NXP USA Inc. |
IC MCU 32BIT 1MB FLASH 208MAPBGA |
Not For New Designs | e200z6 | 32-Bit | 80MHz | CANbus, EBI/EMI, Ethernet, SCI, SPI | DMA, POR, PWM, WDT | 192 | 1MB (1M x 8) | FLASH | - | 64K x 8 | 1.35 V ~ 1.65 V | A/D 34x12b | External | -40°C ~ 125°C (TA) | 208-BGA | 208-MAPBGA (17x17) |
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NXP USA Inc. |
NXP 32-BIT MCU POWER ARCH CORE |
Active | e200z4 | 32-Bit | 150MHz | CANbus, EBI/EMI, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 84 | 2MB (2M x 8) | FLASH | - | 128K x 8 | 1.14 V ~ 5.25 V | A/D 40x12b | Internal | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) |
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NXP USA Inc. |
IC MCU 16BIT 256KB FLASH 160LQFP |
Active | 56800E | 16-Bit | 40MHz | EBI/EMI, SCI, SPI | POR, PWM, WDT | 76 | 256KB (128K x 16) | FLASH | - | 8K x 16 | 2.25 V ~ 3.6 V | A/D 16x12b | External | -40°C ~ 105°C (TA) | 160-LQFP | 160-LQFP (24x24) |
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NXP USA Inc. |
IC MCU 32BIT ROMLESS 144LQFP |
Not For New Designs | CPU32 | 32-Bit | 20MHz | EBI/EMI, SCI, SPI, UART/USART | POR, PWM, WDT | 18 | - | ROMless | - | - | 4.5 V ~ 5.5 V | - | Internal | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) |
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NXP USA Inc. |
IC MCU 16BIT 512KB FLASH 144LQFP |
Active | HCS12X | 16-Bit | 80MHz | CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 119 | 512KB (512K x 8) | FLASH | 4K x 8 | 20K x 8 | 2.35 V ~ 5.5 V | A/D 24x10b | External | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) |
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NXP USA Inc. |
NXP 32-BIT MCU POWER ARCH CORE |
Active | e200z4 | 32-Bit | 120MHz | CANbus, EBI/EMI, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 84 | 2MB (2M x 8) | FLASH | - | 128K x 8 | 1.14 V ~ 5.25 V | A/D 40x12b | Internal | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) |
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NXP USA Inc. |
IC MCU 16BIT 60KB FLASH 112LQFP |
Not For New Designs | CPU12 | 16-Bit | 8MHz | CANbus, MI Bus, SCI, SPI | POR, PWM, WDT | 68 | 60KB (60K x 8) | FLASH | 1K x 8 | 2K x 8 | 4.5 V ~ 5.5 V | A/D 16x8/10b | Internal | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) |
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NXP USA Inc. |
IC MCU 32BIT 4MB FLASH 256MAPBGA |
Active | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) |
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NXP USA Inc. |
IC MCU 32BIT 1MB FLASH 144LQFP |
Active | e200z0, e200z1 | 32-Bit Dual-Core | 66MHz | CANbus, EBI/EMI, I²C, SCI, SPI | DMA, POR, PWM, WDT | 111 | 1MB (1M x 8) | FLASH | - | 64K x 8 | 4.5 V ~ 5.25 V | A/D 40x12b | Internal | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) |
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NXP USA Inc. |
IC MCU 32BIT 1.5MB FLASH 208BGA |
Active | e200z3 | 32-Bit | 80MHz | CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART | DMA, POR, PWM, WDT | 80 | 1.5MB (1.5M x 8) | FLASH | - | 94K x 8 | 4.5 V ~ 5.25 V | A/D 34x12b | Internal | -40°C ~ 125°C (TA) | 208-BGA | 208-MAPBGA (17x17) |
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NXP USA Inc. |
IC MCU 32BIT 1.5MB FLASH 208BGA |
Active | e200z3 | 32-Bit | 80MHz | CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART | DMA, POR, PWM, WDT | 80 | 1.5MB (1.5M x 8) | FLASH | - | 94K x 8 | 4.5 V ~ 5.25 V | A/D 34x12b | Internal | -40°C ~ 125°C (TA) | 208-BGA | 208-MAPBGA (17x17) |
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NXP USA Inc. |
IC MCU 32BIT 1MB FLASH 208MAPBGA |
Active | e200z0, e200z1 | 32-Bit Dual-Core | 80MHz | CANbus, EBI/EMI, I²C, SCI, SPI | DMA, POR, PWM, WDT | 144 | 1MB (1M x 8) | FLASH | - | 64K x 8 | 4.5 V ~ 5.25 V | A/D 40x12b | Internal | -40°C ~ 105°C (TA) | 208-BGA | 208-MAPBGA (17x17) |
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NXP USA Inc. |
ARM 32-BIT MCU TRIPLE CORE 2MB |
Active | ARM® Cortex®-A5, -M4, -M0+ | 32-Bit Tri-Core | 80MHz, 160MHz, 320MHz | CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI | DMA, LCD, LVD/HVD, POR, PWM, WDT | - | 2MB (2M x 8) | FLASH | - | 2.3M x 8 | 3.15 V ~ 5.5 V | A/D 24x12b | Internal | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-LQFP (28x28) |
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NXP USA Inc. |
DUAL CORE 3M FLASH 384 |
Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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NXP USA Inc. |
912XDT512J1 GENERAL |
Active | HCS12X | 16-Bit | 80MHz | CANbus, I²C, SCI, SPI | LVD, POR, PWM, WDT | 59 | 512KB (512K x 8) | FLASH | 4K x 8 | 20K x 8 | 3.15 V ~ 5.5 V | A/D 8x12b | External | -40°C ~ 125°C (TA) | 80-QFP | 80-QFP (14x14) |
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NXP USA Inc. |
IC MCU 32BIT 3MB FLASH 256MAPBGA |
Active | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) |
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NXP USA Inc. |
32 BITDUAL CORE3M FLASH384 RA |
Active | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) |
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NXP USA Inc. |
32 BIT3M FLASH384 RAM |
Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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NXP USA Inc. |
32BIT MCU2KRAMTPUQSM |
Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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NXP USA Inc. |
NXP 32-BIT MCU POWER ARCH CORE |
Active | e200z4d | 32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 128K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | 176-LQFP | 176-LQFP (24x24) |
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NXP USA Inc. |
IC MCU 32BIT ROMLESS 360PBGA |
Active | Coldfire V4 | 32-Bit | 266MHz | I²C, SPI, SSI, UART/USART, USB OTG | DMA, WDT | 132 | - | ROMless | - | 32K x 8 | 1.35 V ~ 3.6 V | - | Internal | 0°C ~ 70°C (TA) | 360-BBGA | 360-PBGA (23x23) |
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NXP USA Inc. |
IC MCU 8BIT 32KB FLASH 80QFP |
Not For New Designs | CPU12 | 16-Bit | 8MHz | SCI, SPI | POR, PWM, WDT | 63 | 32KB (32K x 8) | FLASH | 768 x 8 | 1K x 8 | 4.5 V ~ 5.5 V | A/D 8x10b | External | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) |
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NXP USA Inc. |
IC MCU 32BIT ROMLESS 144LQFP |
Not For New Designs | Coldfire V2 | 32-Bit | 120MHz | I²C, IDE, Memory Card, SPI, UART/USART | DMA, I²S, POR, Serial Audio, WDT | 34 | - | ROMless | - | 96K x 8 | 3 V ~ 3.6 V | A/D 4x12b | External | 0°C ~ 70°C (TA) | 144-LQFP | 144-LQFP (20x20) |
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NXP USA Inc. |
IC MCU 32BIT 4MB FLASH 256MAPBGA |
Active | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) |
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NXP USA Inc. |
IC MCU 32BIT ROMLESS 160MAPBGA |
Not For New Designs | Coldfire V2 | 32-Bit | 140MHz | I²C, IDE, Memory Card, SPI, UART/USART | DMA, I²S, POR, Serial Audio, WDT | 47 | - | ROMless | - | 96K x 8 | 3 V ~ 3.6 V | A/D 4x12b | External | 0°C ~ 70°C (TA) | 160-BGA | 160-MAPBGA (15x15) |
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NXP USA Inc. |
NXP 32-BIT MCU DUAL POWER ARCH |
Active | e200z4d, e200z0h | 32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | 176-LQFP | 176-LQFP (24x24) |
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NXP USA Inc. |
NXP 32-BIT MCU DUAL POWER ARCH |
Active | e200z4d, e200z0h | 32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | 176-LQFP | 176-LQFP (24x24) |
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NXP USA Inc. |
DUAL CORE 3M FLASH 384K RAM F |
Active | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
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NXP USA Inc. |
ARM 32-BIT MCU TRIPLE CORE 3MB |
Active | ARM® Cortex®-A5, -M4, -M0+ | 32-Bit Tri-Core | 80MHz, 160MHz, 320MHz | CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI | DMA, LCD, LVD/HVD, POR, PWM, WDT | - | 3MB (3M x 8) | FLASH | - | 2.3M x 8 | 3.15 V ~ 5.5 V | A/D 24x12b | Internal | -40°C ~ 105°C (TA) | 516-BGA | 516-MAPBGA (27x27) |
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NXP USA Inc. |
DUAL CORE 3M FLASH 512K RAM F |
Active | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
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NXP USA Inc. |
IC MCU 32BIT 4MB FLASH 176LQFP |
Active | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
