品番 メーカー/ブランド 簡単な説明 部品ステータスアプリケーション電流 - 供給電圧 - 供給動作温度取付タイプパッケージ/ケースサプライヤデバイスパッケージ
NXP USA Inc. IC SBC HIGH SPEED CAN 5V 32SOIC Last Time BuySystem Basis Chip2mA5.5 V ~ 28 V-40°C ~ 125°CSurface Mount32-BSSOP (0.295", 7.50mm Width) Exposed Pad32-SOIC
NXP USA Inc. IC SBC HIGH SPEED CAN 5V 32SOIC Last Time BuySystem Basis Chip2mA5.5 V ~ 28 V-40°C ~ 125°CSurface Mount32-BSSOP (0.295", 7.50mm Width) Exposed Pad32-SOIC
NXP USA Inc. IC SBC HIGH SPD CAN 3.3V 32SOIC Last Time BuySystem Basis Chip2mA5.5 V ~ 28 V-40°C ~ 125°CSurface Mount32-BSSOP (0.295", 7.50mm Width) Exposed Pad32-SOIC
NXP USA Inc. IC SBC HIGH SPEED CAN 5V 32SOIC Last Time BuySystem Basis Chip2mA5.5 V ~ 28 V-40°C ~ 125°CSurface Mount32-BSSOP (0.295", 7.50mm Width) Exposed Pad32-SOIC
ON Semiconductor IC DRIVER HALF BRIDGE HEX ActiveAutomotive7.5mA5.5 V ~ 28 V-40°C ~ 150°CSurface Mount36-BFSOP (0.295", 7.50mm Width) Exposed Pad36-SSOP