|
Parker Chomerics |
CHO-SEAL 6502 NI/AL EMI 0.156 |
Active | Gasket | Round | 0.080" (2.03mm) | - | 0.080" (2.03mm) | Conductive Elastomer | Nickel | - | Non-Conductive Adhesive | -29°C ~ 66°C |
|
Laird Technologies EMI |
TWTSTRBFUSFPSA |
Active | Fingerstock | - | 0.200" (5.08mm) | 24.000" (609.60mm) | 0.070" (1.78mm) | Beryllium Copper | - | - | Adhesive | 121°C |
|
Laird Technologies EMI |
TWTSTRBFUSFPSA |
Active | Fingerstock | - | 0.300" (7.62mm) | 24.000" (609.60mm) | 0.070" (1.78mm) | Beryllium Copper | - | - | Adhesive | 121°C |
|
Laird Technologies EMI |
CSTRSTRNID |
Active | - | - | - | - | - | - | - | - | - | - |
|
Laird Technologies EMI |
DESSTRSNBCLO |
Active | - | - | 0.183" (4.65mm) | 12.000" (304.80mm) | - | - | - | - | - | - |
|
Laird Technologies EMI |
TWTSTRBFUSFTCLO |
Active | - | - | - | - | - | - | - | - | - | - |
|
Parker Chomerics |
CHO-SEAL 6502 NI/AL EMI 0.125 |
Active | Gasket | Round | 0.125" (3.17mm) | - | 0.125" (3.17mm) | Conductive Elastomer | Nickel | - | Non-Conductive Adhesive | -29°C ~ 66°C |
|
Leader Tech Inc. |
.060H X .280W X 48L--RECTANGU |
Active | Fabric Over Foam | Rectangular | 0.280" (7.11mm) | 4.00' (1.22m) | 0.060" (1.52mm) | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | - | - | - | -40°C ~ 70°C |
|
Leader Tech Inc. |
.080H X .200W X 48L--RECTANGU |
Active | Fabric Over Foam | Rectangular | 0.200" (5.08mm) | 4.00' (1.22m) | 0.080" (2.03mm) | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | - | - | - | -40°C ~ 70°C |
|
Leader Tech Inc. |
.080H X .275W X 48L--RECTANGU |
Active | Fabric Over Foam | Rectangular | 0.275" (6.99mm) | 4.00' (1.22m) | 0.080" (2.03mm) | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | - | - | - | -40°C ~ 70°C |
|
Laird Technologies EMI |
CSTRSTRSNB |
Active | - | - | - | - | - | - | - | - | - | - |
|
Laird Technologies EMI |
S3STRSNBPSA |
Active | Fingerstock | - | 0.350" (8.89mm) | 15.000" (381.00mm) | 0.110" (2.79mm) | Beryllium Copper | Tin | 299.21µin (7.60µm) | Adhesive | 121°C |
|
Laird Technologies EMI |
S3STRSNB |
Active | Fingerstock | - | 0.350" (8.89mm) | 15.000" (381.00mm) | 0.110" (2.79mm) | Beryllium Copper | - | - | Adhesive | 121°C |
|
Leader Tech Inc. |
MESH COMBO GASKET W/ADH--7900-90 |
Active | Gasket | Rectangular | 0.500" (12.70mm) | - | 0.188" (4.78mm) | - | - | - | - | -75°C ~ 260°C |
|
Laird Technologies EMI |
TWTSTRBF |
Active | Fingerstock | - | 0.500" (12.70mm) | 24.000" (609.60mm) | 0.070" (1.78mm) | Beryllium Copper | - | - | Adhesive | 121°C |
|
Leader Tech Inc. |
0.22 X 0.60 BD 16--22-S-60AF-BD- |
Active | Fingerstock | - | 0.600" (15.24mm) | 16.000" (406.40mm) | 0.220" (5.59mm) | Beryllium Copper | Unplated | - | Adhesive | -55°C ~ 121°C |
|
Laird Technologies EMI |
TWTSTRSNBUSFPSA |
Active | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.030" (0.76mm) | Beryllium Copper | Tin | 299.21µin (7.60µm) | Adhesive | 121°C |
|
Laird Technologies EMI |
TWTSTRNIBUSFTPSA |
Active | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.030" (0.76mm) | Beryllium Copper | Nickel | 299.21µin (7.60µm) | Adhesive | 121°C |
|
Laird Technologies EMI |
TWTSTRSNBUSFPSA |
Active | Fingerstock | - | 0.160" (4.06mm) | 24.000" (609.60mm) | 0.030" (0.76mm) | Beryllium Copper | Tin | 299.21µin (7.60µm) | Adhesive | 121°C |
|
Laird Technologies EMI |
TWTSTRNIBUSFTPSA |
Active | Fingerstock | - | 0.160" (4.06mm) | 24.000" (609.60mm) | 0.030" (0.76mm) | Beryllium Copper | Nickel | 299.21µin (7.60µm) | Adhesive | 121°C |
|
Laird Technologies EMI |
GK NICU NRS PU V0 DSH |
Active | Fabric Over Foam | D-Shape | 0.402" (10.20mm) | 48.000" (121.92cm) | 0.181" (4.60mm) | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | - | - | - | - |
|
Laird Technologies EMI |
CSTRSTRBF |
Active | - | - | - | - | - | - | - | - | - | - |
|
Laird Technologies EMI |
CSTRSTRSNBUSFT |
Active | - | - | - | - | - | - | - | - | - | - |
|
Laird Technologies EMI |
LSSTRSNBUSFTCLO |
Active | - | - | - | - | - | - | - | - | - | - |
|
Leader Tech Inc. |
0.03 X 0.08 BD 24--TWIST RIGHT A |
Active | Fingerstock | - | 0.080" (2.03mm) | 24.000" (609.60mm) | 0.030" (0.76mm) | Beryllium Copper | Unplated | - | Adhesive | -55°C ~ 121°C |
|
Leader Tech Inc. |
0.03 X 0.23 BD 24--3-S-23T-BD-24 |
Active | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.030" (0.76mm) | Beryllium Copper | Unplated | - | Adhesive | -55°C ~ 121°C |
|
Leader Tech Inc. |
0.03 X 0.23 BD 24--TWIST RIGHT A |
Active | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.030" (0.76mm) | Beryllium Copper | Unplated | - | Adhesive | -55°C ~ 121°C |
|
Laird Technologies EMI |
TWTSTRZNCCLO |
Active | Fingerstock | - | 0.150" (3.81mm) | 16.000" (406.40mm) | 0.030" (0.76mm) | Beryllium Copper | Zinc + Clear Chromate | 299.21µin (7.60µm) | Clip | 121°C |
|
Laird Technologies EMI |
GASKET FABRIC/FOAM 3MM SQ |
Active | Fabric Over Foam | Rectangle | 0.118" (3.00mm) | 49.700" (126.24cm) | 0.118" (3.00mm) | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | - | - | - | - |
|
Laird Technologies EMI |
TWTSTRZNCPSA |
Active | Fingerstock | - | 0.340" (8.64mm) | 24.000" (609.60mm) | 0.070" (1.78mm) | Beryllium Copper | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | 121°C |
|
Laird Technologies EMI |
GK NICU NRS PU V0 BELL |
Active | Fabric Over Foam | Bell | 0.299" (7.60mm) | 36.000" (914.40mm) | 0.098" (2.50mm) | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | - | - | - | - |
|
Leader Tech Inc. |
0.25 X 1.09 BD 24--FOLDED SERIES |
Active | Fingerstock | - | 1.090" (27.69mm) | 24.000" (609.60mm) | 0.250" (6.35mm) | Beryllium Copper | Unplated | - | Adhesive | -55°C ~ 121°C |
|
Laird Technologies EMI |
DSTRSDECE093 6.4X6.4X3.2MM |
Active | - | - | - | - | - | - | - | - | - | - |
|
Laird Technologies EMI |
STS3STRZNCPSA |
Active | Fingerstock | - | 0.350" (8.89mm) | 15.000" (381.00mm) | 0.110" (2.79mm) | Beryllium Copper | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | 121°C |
|
Laird Technologies EMI |
S3STRNIEPSA |
Active | Fingerstock | - | 0.350" (8.89mm) | 15.000" (381.00mm) | 0.110" (2.79mm) | Beryllium Copper | Nickel | 299.21µin (7.60µm) | Adhesive | 121°C |
|
Laird Technologies EMI |
S3STRNIBPSA |
Active | Fingerstock | - | 0.350" (8.89mm) | 15.000" (381.00mm) | 0.110" (2.79mm) | Beryllium Copper | Nickel | 299.21µin (7.60µm) | Adhesive | 121°C |
|
Laird Technologies EMI |
DSTRSDCUSTMATL 6.35X6.35X3.18MM |
Active | - | - | - | - | - | - | - | - | - | - |
|
Leader Tech Inc. |
0.11 X 0.28 X 0.23 NI 16--FOLDED |
Active | Fingerstock | - | 0.280" (7.11mm) | 16.000" (406.40mm) | 0.110" (2.79mm) | Beryllium Copper | Nickel | Flash | Adhesive | -55°C ~ 121°C |
|
Laird Technologies EMI |
FINGERSTOCK BECU 10.4X406.4MM |
Active | Fingerstock | - | 0.414" (10.52mm) | 16.000" (406.40mm) | 0.210" (5.33mm) | Beryllium Copper | - | - | Clip | 121°C |
|
Laird Technologies EMI |
CSTRSTRBF |
Active | - | - | - | - | - | - | - | - | - | - |
|
Laird Technologies EMI |
CSTRSTRBF |
Active | Fingerstock | - | 1.630" (41.40mm) | 25.000' (7.60m) | 0.410" (10.41mm) | Beryllium Copper | - | - | Hardware, Rivet, Solder | 121°C |
|
Laird Technologies EMI |
AMDFBECURL .250X.750IN |
Active | Gasket | Double D-Shape | 0.750" (19.10mm) | - | 0.252" (6.40mm) | - | Unplated | - | - | - |
|
Laird Technologies EMI |
FINGERSTOCK BECU 15.24X406.4MM |
Active | Fingerstock | - | 0.600" (15.24mm) | 16.000" (406.40mm) | 0.210" (5.33mm) | Beryllium Copper | - | - | Clip | 121°C |
|
Laird Technologies EMI |
CSTRSTRSNBUSFT |
Active | - | - | - | - | - | - | - | - | - | - |
|
Laird Technologies EMI |
PCBSCOILSNB .084X.715X.200X25F |
Active | - | - | - | - | - | - | - | - | - | - |
|
Leader Tech Inc. |
0.11 X 0.32 NI 16--11-32AF-NI-16 |
Active | Fingerstock | - | 0.320" (8.13mm) | 16.000" (406.40mm) | 0.110" (2.79mm) | Beryllium Copper | Nickel | Flash | Adhesive | -55°C ~ 121°C |
|
Leader Tech Inc. |
0.11 X 0.32 NI 16--11-32RH-NI-16 |
Active | Fingerstock | - | 0.320" (8.13mm) | 16.000" (406.40mm) | 0.110" (2.79mm) | Beryllium Copper | Nickel | Flash | Adhesive | -55°C ~ 121°C |
|
Laird Technologies EMI |
GK NICU NRS PU V0 CSH |
Active | Fabric Over Foam | C-Fold | 0.280" (7.10mm) | 18.000" (457.20mm) | 0.252" (6.40mm) | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | - | - | - | - |
|
Laird Technologies EMI |
APSTRBF |
Active | Fingerstock | - | 0.280" (7.11mm) | 16.000" (406.40mm) | 0.110" (2.79mm) | Beryllium Copper | - | - | Adhesive | 121°C |
|
Leader Tech Inc. |
0.11 X 0.28 NI 16 NTP--FOLDED SE |
Active | Fingerstock | - | 0.280" (7.11mm) | 16.000" (406.40mm) | 0.110" (2.79mm) | Beryllium Copper | Nickel | Flash | Adhesive | -55°C ~ 121°C |