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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 250ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 250ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 150ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 200ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 3ms | 150ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 120ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 150ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 120ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 3ms | 120ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 90ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 90ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 90ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 3ms | 90ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 120ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 3ms | 120ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 90ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 3ms | 90ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28CPGA |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 150ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28CDIP |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 200ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28CDIP |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 150ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28CDIP |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 200ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28CDIP |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 250ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28CDIP |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 3ms | 150ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28CDIP |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 120ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28CDIP |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 90ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28CDIP |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 120ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28CDIP |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 90ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28CDIP |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 3ms | 120ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28CDIP |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 3ms | 90ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP |
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Microchip Technology |
IC EEPROM 1M PARALLEL 32FLATPCK |
Active | Non-Volatile | EEPROM | EEPROM | 1Mb (128K x 8) | - | 10ms | 200ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 1M PARALLEL 32LCC |
Active | Non-Volatile | EEPROM | EEPROM | 1Mb (128K x 8) | - | 10ms | 200ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 1M PARALLEL 32FLATPCK |
Active | Non-Volatile | EEPROM | EEPROM | 1Mb (128K x 8) | - | 10ms | 250ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 1M PARALLEL 32LCC |
Active | Non-Volatile | EEPROM | EEPROM | 1Mb (128K x 8) | - | 10ms | 150ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 1M PARALLEL 32LCC |
Active | Non-Volatile | EEPROM | EEPROM | 1Mb (128K x 8) | - | 10ms | 120ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 1MBIT 120NS 44CLCC |
Active | Non-Volatile | EEPROM | EEPROM | 1Mb (128K x 8) | - | 10ms | 120ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 44-CLCC | 44-CLCC (16.54x16.54) |
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Microchip Technology |
IC EEPROM 1M PARALLEL 32FLATPCK |
Active | Non-Volatile | EEPROM | EEPROM | 1Mb (128K x 8) | - | 10ms | 150ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 1M PARALLEL 32CDIP |
Active | Non-Volatile | EEPROM | EEPROM | 1Mb (128K x 8) | - | 10ms | 120ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 32-CDIP (0.600", 15.24mm) Window | 32-CDIP |
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Microchip Technology |
IC EEPROM 1M PARALLEL 32LCC |
Active | Non-Volatile | EEPROM | EEPROM | 1Mb (128K x 8) | - | 10ms | 120ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 1MBIT 150NS 44CLCC |
Active | Non-Volatile | EEPROM | EEPROM | 1Mb (128K x 8) | - | 10ms | 150ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 44-CLCC | 44-CLCC (16.54x16.54) |
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Microchip Technology |
IC EEPROM 1M PARALLEL 32FLATPCK |
Active | Non-Volatile | EEPROM | EEPROM | 1Mb (128K x 8) | - | 10ms | 120ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 1M PARALLEL 32CDIP |
Active | Non-Volatile | EEPROM | EEPROM | 1Mb (128K x 8) | - | 10ms | 150ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 32-CDIP (0.600", 15.24mm) Window | 32-CDIP |
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Microchip Technology |
IC EEPROM 1M PARALLEL 32CDIP |
Active | Non-Volatile | EEPROM | EEPROM | 1Mb (128K x 8) | - | 10ms | 200ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 32-CDIP (0.600", 15.24mm) Window | 32-CDIP |
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Microchip Technology |
IC EEPROM 1M PARALLEL 32CDIP |
Active | Non-Volatile | EEPROM | EEPROM | 1Mb (128K x 8) | - | 10ms | 250ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 32-CDIP (0.600", 15.24mm) Window | 32-CDIP |
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Microchip Technology |
IC EEPROM 1MBIT 120NS 44CLCC |
Active | Non-Volatile | EEPROM | EEPROM | 1Mb (128K x 8) | - | 10ms | 120ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 44-CLCC | 44-CLCC (16.54x16.54) |
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Microchip Technology |
IC EEPROM 1MBIT 150NS 44CLCC |
Active | Non-Volatile | EEPROM | EEPROM | 1Mb (128K x 8) | - | 10ms | 150ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 44-CLCC | 44-CLCC (16.54x16.54) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28CDIP |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 150ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP |
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Microchip Technology |
IC EEPROM 1M PARALLEL 32CDIP |
Active | Non-Volatile | EEPROM | EEPROM | 1Mb (128K x 8) | - | 10ms | 120ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 32-CDIP (0.600", 15.24mm) Window | 32-CDIP |
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Microchip Technology |
IC EEPROM 1M PARALLEL 32CDIP |
Active | Non-Volatile | EEPROM | EEPROM | 1Mb (128K x 8) | - | 10ms | 150ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 32-CDIP (0.600", 15.24mm) Window | 32-CDIP |
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Microchip Technology |
IC EPROM 1M PARALLEL 32PLCC |
Obsolete | Non-Volatile | EPROM | EPROM - OTP | 1Mb (128K x 8) | - | - | 90ns | Parallel | 2.7 V ~ 3.6 V, 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
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Microchip Technology |
IC EPROM 1M PARALLEL 32PLCC |
Obsolete | Non-Volatile | EPROM | EPROM - OTP | 1Mb (128K x 8) | - | - | 120ns | Parallel | 2.7 V ~ 3.6 V, 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
