Fabricantes de Interfaz - Telecomunicaciones
| Número de pieza | Fabricante / Marca | Breve descripción | Estado de la pieza | Función | Interfaz | Cantidad de circuitos | Suministro de voltaje | Suministro de corriente | Potencia (vatios) | Temperatura de funcionamiento | Tipo de montaje | Paquete / caja | Paquete de dispositivo del proveedor |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Maxim Integrated | IC BUFFER RECEIVE T1 24-DIP | Obsolete | Receive Buffer | TDM | 1 | 5mA | 0°C ~ 70°C | Through Hole | 24-DIP (0.300", 7.62mm) | 24-PDIP | |||
| Maxim Integrated | IC BUFFER RECEIVE T1 IND 24-DIP | Obsolete | Receive Buffer | TDM | 1 | 5mA | 0°C ~ 70°C | Through Hole | 24-DIP (0.300", 7.62mm) | 24-PDIP | |||
| Texas Instruments | IC ADAPTER DIG QDASL QUAD 28PLCC | Active | ISDN | TDM | 1 | 5V | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) | ||||
| Microsemi Corporation | IC CESOP PROCESSOR 128CH 324BGA | Active | Telecom Circuit | TDM | 1 | 1.65 V ~ 1.95 V | 950mA | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) | ||
| Microsemi Corporation | IC CESOP PROCESSOR 32CH 324BGA | Active | Telecom Circuit | TDM | 1 | 1.65 V ~ 1.95 V | 950mA | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |